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2uul PB02 PadBall Solder Balls For Android– 100000 Balls/Bottle


₹ 429 ₹ 900 52% off


Specification:

  • Material: Sn63/Pb37 (Tin 63%/Lead 37%)
  • Size Options: 0.2mm, 0.3mm, 0.45mm, 0.6mm, 0.76mm
  • Package: Sealed anti-static bottle (131*105*48mm)
  • Net Weight: 5.5g (iPhone) / 7.2g (Android)
  • Applications: Restore damaged pads
  • on iPhone/Android mainboards; Reballing GPU, CPU
  • or chipset components; Precision PCB repairs under microscope

1

Description

2uul PB02 PadBall Solder Balls For Android– 100000 Balls/Bottle

Description

2UUL PadBall Solder Balls for Solder Pad Rework Repair. 2UUL PadBall Solder balls Sn63/Pb37 high conductivity for soldering missing solder joints on iPhone and Android Phones motherboard solder pad. Uniform size solder balls can quickly repair the missing solder joints on the mobile phone motherboard circuit board, effectively improving the efficiency of mobile phone repair.

Option (100000 pcs/bottle):
1. 2UUL PB01 PadBall Solder Balls for  Android Solder Pad Rework.
2. 2UUL PB02 PadBall Solder Balls for iPhone Solder Pad Rework. 

Please note that the solder balls can only be sent out by special way (post mail).

2uul PB02 PadBall Solder Balls For Android– 100000 Balls/Bottle

2uul PB02 PadBall Solder Balls For Android– 100000 Balls/Bottle

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