Maant My-224-Or 10cc Bga Soldering Paste
High-quality BGA soldering paste designed for precise PCB repair work.
MaAnt MY-224-OR solder paste ideal for BGA, SMD, and micro soldering tasks.
Smooth and stable solder paste for reliable chip and motherboard repair.
10cc syringe design for easy and accurate solder paste application.
Provides strong solder joints for mobile phone and electronics repair.
Perfect for IC reballing and fine-pitch component soldering.
Professional grade solder paste for technicians and repair engineers.
Excellent wetting performance for clean and durable solder connections.
Suitable for smartphone motherboard, PCB, and chip level repair.
Reliable BGA soldering paste for precision electronics work.
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MAANT MY-224-OR (10CC) BGA Soldering Paste is a high-performance, lead-free solder paste designed for BGA (Ball Grid Array) and fine-pitch component soldering. It offers excellent printing, reflow, and tackiness properties, ensuring reliable solder joints. Ideal for high-precision applications in electronics manufacturing, it provides consistent, stable performance.
| Feature | Details |
|---|---|
| Brand | Maant |
| Product Name | MY-224-OR BGA Soldering Paste |
| Volume | 10CC |
| Color | Light Yellow (varies by batch) |
| Type | Lead-free BGA soldering paste |
| Suitable For | BGA (Ball Grid Array), fine-pitch components, electronics assembly |
| Drying Time | Non-drying, stable during reflow process |
| Finish After Drying | Smooth, reliable solder joints without hardening |
| Bottle/Tube Design | Easy-apply syringe for precise application |
| Non-Corrosive | Yes, safe for all electronic components |
| Durability | Excellent performance at high temperatures, long-lasting |
| Portability |
Compact 10CC size, ideal for precision soldering tasks |






