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Maant Ip14-Plus-Pro-Max Stencil


₹ 129 ₹ 260 50% off


  • Square-hole chamfered design provides burr-free, jam-free tin planting.

  • High-temperature-resistant alloy steel retains flexibility and shape.

  • Precise mesh calibration for accurate alignment with solder pads.

  • Produces fuller, rounder tin balls for reliable solder joints.

  • Available as a single model (14?series) 

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Description

Maant Ip14-Plus-Pro-Max Stencil

The MaAnt 0.12?mm Square-Hole BGA Reballing Stencil is a high-precision steel mesh tool designed specifically for reballing IC components—such as CPUs, NAND, and Wi?Fi modules—on iPhones (notably the 14-series). Its ultra-fine 0.12?mm square holes ensure uniform tin ball formation, while the alloy steel construction resists deformation from heat and repeated use.\

Feature MaAnt 14Series Stencil  
Model Coverage iPhone14 / 14Plus / 14Pro / 14ProMax  
Hole Size 0.12mm  
Material High-temperature resistant alloy steel  
Precision Square-hole fillet; burr-free; accurate  
Flexibility Durable, reusable, shape-retaining  
Use Case Tin reballing for 14series repairs  

 

Maant Ip14-Plus-Pro-Max Stencil

 

 

 

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