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Maant Ip16-Plus-Pro-Max Stencil


₹ 129 ₹ 260 50% off


  • Ultra-fine 0.12?mm square hole design for clean, jam-free tin ball formation

  • High-temperature-resistant alloy steel with long-term flexibility

  • Accurate alignment for uniform soldering and full, round tin balls

  • Broad iPhone 16-series compatibility (16, 16 Plus, 16 Pro, 16 Pro Max)

  • Compact, reusable, and ideal for professional reballing applications

1

Description

Maant Ip16-Plus-Pro-Max Stencil

The MaAnt 0.12mm Square?Hole BGA Reballing Stencil for the iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 series) is a precision tool crafted for chip reballing tasks. Engineered with a high-strength alloy steel mesh, its square?hole, chamfered design ensures burr-free tin application. Flexible yet resilient, it withstands heat and frequent use—making it ideal for CPU, NAND, Wi?Fi, Baseband, and NFC component repairs.

Feature MaAnt 16?Series Only Stencil    
Model Coverage iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max    
Primary Use Case Focused reballing for 16-series chips    
Hole Size 0.12?mm square    
Material Alloy steel    
Durability High-temperature resistant and flexible    
Precision High accuracy, burr-free    
Packaging Single stencil    

Maant Ip16-Plus-Pro-Max Stencil

 

 

 

 

 


 

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