MaAnt Ip15-Plus Pro Max Stencil
Specially designed for iPhone 15 Plus & iPhone 15 Pro Max BGA reballing
Made with premium stainless steel for strength & durability
Precise aperture design ensures accurate solder ball placement
Ultra-thin design for smooth solder paste application
Heat-resistant, anti-deformation, and long-lasting performance
Ideal for logic board repair, chip reballing & motherboard rework
Perfect tool for mobile repair professionals & technicians
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The MAANT IP15-PLUS-PRO-MAX Stencil is a high-precision reballing tool crafted for iPhone 15 Plus and iPhone 15 Pro Max logic board repair. Built with durable stainless steel, this stencil guarantees reliability even under repeated high-temperature usage. Its ultra-fine aperture design ensures accurate solder ball alignment, enabling seamless BGA reballing for IC chips and motherboard components.
Thanks to its thin and heat-resistant structure, solder paste spreads evenly without clogging, while the rigid frame prevents warping during work. Whether you are repairing, refurbishing, or reballing chips, this stencil provides unmatched precision and efficiency. It’s a must-have accessory for every mobile repair shop and DIY technician aiming for professional-quality results.