AMAOE HWB-2 STENCIL


₹ 145 ₹ 139 -4% off


  • High-quality stainless steel construction for durability

  • Ideal for reballing and reworking ICs

  • Reusable after cleaning for multiple repair jobs

  • Compatible with solder paste or flux for precise paste application

  • Helps ensure consistent solder joints with minimal bridging

1

Description

AMAOE HWB-2 STENCIL

Stencil is a high-precision reballing tool specially developed for motherboard IC repair of the smartphone. Manufactured with durable, heat-resistant stainless steel, this stencil ensures accurate alignment and smooth solder paste deposition for BGA rework.

Its laser-cut micro-holes perfectly match the original pad layout of key ICs on the  board, ensuring efficient solder ball planting and preventing bridging or paste overflow. This stencil supports both hot air and reflow methods, making it suitable for professional technicians working with CPU, PMIC, NAND, audio IC, charging IC, network IC, RAM, and other micro components.

Designed for repeated use, the stencil delivers strong rigidity, reduced warping under heat, and excellent tin absorption, providing stable performance even in heavy repair environments. For mobile repair shops, it guarantees faster workflow, higher success rates, and cleaner solder joints on sensitive OnePlus components.

AMAOE HWB-2 STENCIL

 

Verified Reviews

Related Products

AMAOE U-MIXU2 CPU STENCIL

₹ 145 ₹ 400
64% off    

1

Amaoe 1.0mm 50*50 Stencil

₹ 239 ₹ 600
60% off    

1

Mechanic Amaoe 11/PRO/MAX Stencil

₹ 69 ₹ 300
77% off    

1

AMAOE MI-1 STENCIL For Redmi

₹ 145 ₹ 400
64% off    

1

JTX ZX-01 Iphone 15 Series Silicone Middle Layer Bga Reballing Platform Set

₹ 349 ₹ 700
50% off    

1

Only 1 Product left!

Mechanic Itin 05 A11 CPU Stencil

₹ 159 ₹ 500
68% off    

1

Maant Ip16-Plus-Pro-Max Stencil

₹ 129 ₹ 260
50% off    

1