2UUL GS158 JOINT X 158°C 50G SOLDER PASTE
2UUL GS158 Joint X low-temperature solder paste
Melting point 158°C for safe PCB repair
50g pack ideal for professional technicians
Smooth paste for precise soldering
Perfect for SMD, BGA & IC work
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Low-Temperature Solder Paste: 2UUL GS158 Joint X melts at 158°C, reducing heat stress on sensitive PCB components
Strong & Reliable Joints: Ensures excellent bonding strength and long-lasting solder connections
Smooth & Stable Texture: Easy to apply with syringe or stencil, no splashing during heating
High Wettability: Improves solder flow for clean and shiny joints
Minimal Residue: Leaves low residue after soldering, easy to clean
Wide Applications: Ideal for SMD, BGA reballing, IC repair, and mobile phone motherboard work
Professional Grade Quality: Suitable for mobile repair shops, electronics labs, and advanced PCB repair
Packaging: 50g sealed container, long shelf life and consistent performance

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