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2UUL BG02 Universal Reballing Stencil 2pcs/pack


₹ 329 ₹ 700 53% off


  • 1. Universal 2UUL BG02 reballing stencil designed for precise BGA chip reballing.

  • 2. High-precision stainless steel stencil for accurate solder ball placement.

  • 3. Professional reballing stencil suitable for multiple IC and chipset repairs.

  • 4. Durable heat-resistant stencil ideal for mobile phone motherboard repair.

  • 5. Universal BGA reballing tool for technicians and repair shops.

  • 6. Fine hole design ensures uniform solder ball distribution during reballing.

  • 7. Easy-to-use reballing stencil for fast and clean IC repair work.

  • 8. Strong and reusable stencil built for long-term professional use.

  • 9. Essential reballing accessory for CPU, IC, and chipset maintenance.

  • 10. 2pcs per pack universal stencil for reliable BGA reballing repairs.

1

Description

2UUL BG02 Universal Reballing Stencil 2pcs/pack

2UUL BG02 Universal Reballing Stencil AB with Various Pitch Sizes for Mobile Phone and iPhone X-17 Pro Max Chips Soldering and Repair. 2UUL AB Universal Reballing Stencil with 0.3 0.35 0.375 0.4 0.5 0.5 0.65 spacing and 0.5 0.55 0.6 0.62 0.7 0.75 0.8 0.85 pitch size for most mobile phone chips, such as iPhone CPU, Nand flash, WiFi IC, Baseband IC, Small IC, Power Management IC, etc.

Option:
1. 2UUL BG02 AB Reballing Stencil set. 

Features:
1. Multiple Pitch Options: Offers up to 7 A-pitch options (0.3/0.35/0.375/0.4/0.5/0.6/0.65 mm) and 7 B-pitch options (0.5/0.55/0.6/0.62/0.7/0.8/0.85 mm) to meet the needs of different IC types.
2. Includes Blade: Each grid comes with a blade, allowing technicians to easily adjust and cut the grid as needed, ensuring precise ball-bearing operations.
3. Wide Compatibility: Suitable for a wide range of chips including CPUs, NAND, WIFI ICs, Based-DICs, small ICs, and power management ICs, offering excellent compatibility and adaptability.
4. 99% Coverage: Covers most IC packages with only two grid types, saving time and effort and reducing tool change frequency.
5. Precise Design: Precise design ensures accurate alignment during ball bonding, contributing to improved ball-bearing quality and efficiency.

Product Parameters: 
Product Name: BG02 Universal Reballing Stencil
Net Weight: 14g
Gross Weight: 22g
Product Dimensions: 100x85x0.1mm
Packaging Dimensions: 105x90x1.2mm

 

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