JTX PG-5 Explosion-Proof reballing Glass Pad
Premium explosion-proof tempered glass pad for mobile reballing
High heat resistance – safe for BGA & IC rework
Smooth, flat surface for accurate solder ball placement
Non-deformable & crack-resistant design
Ideal for mobile repair technicians & labs
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Made from high-quality explosion-proof tempered glass for maximum safety
Designed specially for IC reballing, BGA rework & soldering jobs
Withstands extreme temperatures without warping or cracking
Perfectly flat surface ensures uniform heating and precise alignment
Easy to clean – solder residue does not stick easily
High transparency allows clear visibility during reballing work
Stable and durable – long service life even with heavy use
Suitable for smartphone, tablet & motherboard repair
Essential tool for professional mobile repair engineers
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