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2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding


₹ 2699 ₹ 6000 55% off


  • Professional HOT-BLOCK preheater for PCB delamination & rebonding

  • Uniform heating for safe motherboard repair

  • Ideal for mobile phone PCB repair and rework

  • Improves success rate of IC rebonding

  • Stable temperature control, reduces board damage

  • Essential tool for advanced repair technicians

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Description

2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding

  • High-quality 2UUL PH11 HOT-BLOCK preheater designed for professional motherboard repair

  • Specially used for PCB delamination rebonding and layered board separation

  • Provides even and controlled heat to avoid overheating sensitive components

  • Helps loosen glue and solder layers before CPU, baseband, or IC rework

  • Improves bonding strength during rebonding and re-lamination process

  • Compatible with most smartphone motherboards (iPhone & Android)

  • Compact, durable design suitable for repair shops and labs

  • Enhances repair efficiency and reduces failure rate

  • Must-have equipment for chip-level mobile repairing

2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding

 

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