Mechanic iTin-12 BGA Reballing Stencil Magnetic Tin Plating Platform
Mechanic iTin-12 magnetic tin plating platform designed for precise BGA chip reballing.
Professional BGA reballing stencil platform for accurate solder ball planting.
Strong magnetic fixing system keeps IC and stencil stable during reballing.
Ideal for mobile phone motherboard and chip-level repair work.
High-precision tin planting platform for efficient BGA soldering tasks.
Durable metal repair base suitable for professional electronics technicians.
Perfect for IC, CPU, and motherboard reballing applications.
Compact repair workstation tool for mobile and PCB maintenance.
Improves chip positioning and solder ball alignment during repair.
Essential BGA reballing tool for advanced micro-soldering and chip repair.
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Mechanic iTin-12 BGA Reballing Stencil Magnetic Tin Plating Platform
Features:
- Flat, non-slip platform for smooth scraping, even solder paste application, one-shot molding
- Powerful magnetic grip locks the stencil in place, with zero deviation, and pinpoint precision
- Non-slip silicone ensures the platform stays put for accurate reballing
- Durable high-temp platform, stays strong under heat, withstands continuous high-temperature work without deforming
- ldeal for: Phone motherboard and computer chip-level repair
Package includes:
- 1 x Reballing Platform
- 2 x Blades