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AMAOE M15SP-XB 15S PRO STENCIL


₹ 149 ₹ 300 50% off


AMAOE M15SP-XB 15S Pro Stencil is a high-precision BGA reballing stencil designed for professional mobile motherboard and IC chip repair.

Made from durable stainless steel, this stencil ensures accurate alignment and consistent solder ball placement for reliable rework results.

Ideal for technicians, the 15S Pro stencil supports advanced chip-level repairs for smartphones and electronics.

Its laser-cut design delivers perfect hole accuracy, making CPU and IC reballing faster and more efficient.

The AMAOE 15S Pro stencil is perfect for mobile repair shops, service centers, and professional repair labs.

Designed for precision micro-soldering, it helps reduce errors during motherboard and PCB rework.

Lightweight and compact, this stencil is easy to handle and perfect for daily repair use.

A must-have tool for chip replacement, solder rework, and professional mobile repairing tasks.

Built for durability and long-term use, it offers consistent performance for repeated reballing jobs.

Upgrade your mobile repair toolkit with the AMAOE M15SP-XB stencil for faster, cleaner, and more accurate repairs.

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Description

AMAOE M15SP-XB 15S PRO STENCIL

 

Amaoe 0.12mm Mid-sized Motherboard Sub-board BGA Reballing Stencil for Xiaomi 15S Pro
 
Package includes:
  • 1 x Stencil

AMAOE M15SP-XB 15S PRO STENCIL

 

Verified Reviews

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