MECHANIC 0.5MM TUNGSTEN STEEL KNIFE 2.35MM
Precision 0.5mm tungsten steel cutting knife for mobile repair.
Durable 2.35mm shank knife for PCB and motherboard work.
High-strength tungsten steel blade for accurate cutting tasks.
Sharp and reliable engraving knife for electronic repairs.
Professional repair knife ideal for chip and PCB cleaning.
Fine-tip tungsten cutter designed for precision mobile work.
Long-lasting steel knife for delicate repair applications.
Compact and lightweight cutting tool for technicians.
Smooth cutting performance for detailed electronic repairs.
MECHANIC tungsten steel knife for precision grinding and carving.
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The MECHANIC 0.5mm Tungsten Steel Knife with a 2.35mm shank is a professional-grade precision tool primarily designed for micro-electronics repair, specifically for tasks like "chip scraping" or "glue removal" on motherboards.
Below is the full product description organized in a tabular format for quick reference.
| Feature | Detailed Description |
| Product Name | Mechanic Tungsten Steel Precision Carving Knife |
| Blade Tip Diameter | 0.5mm (Ultra-Fine) |
| Shank Diameter | 2.35mm (Standard fit for most rotary tools/grinders) |
| Material Composition | High-density Tungsten Steel (Wolfram Steel) |
| Hardness Level | High HRC rating (Wear-resistant and rigid) |
| Primary Application | IC Chip glue removal, PCB circuit repair, jewelry engraving |
| Blade Geometry | Fine-point needle/conical tip for microscopic accuracy |
| Attribute | Benefit |
| Material Durability | Tungsten steel provides superior heat resistance and maintains its sharp edge significantly longer than standard carbon steel. |
| Precision Sizing | The 0.5mm tip allows technicians to work between densely packed components on a logic board without causing collateral damage. |
| Universal Shank | The 2.35mm shank is the industry standard, making it compatible with Mechanic's own electric grinding pens as well as Dremel and other rotary tools. |
| Anti-Vibration Design | Engineered for high-speed rotation with minimal runout, ensuring the tip doesn't "chatter" or skip across delicate surfaces. |
Underfill Removal: Scraping away the hard black glue (epoxy) found around CPU and NAND chips on iPhones and Android devices.
Trace Repair: Gently scratching away the solder mask on a PCB to reveal copper traces for jumper wire installation.
Cleaning Pads: Removing residual solder or debris from BGA (Ball Grid Array) pads after a chip has been desoldered.
Detail Engraving: Used in precision crafts for marking or cutting fine lines in metal, plastic, or wood.






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