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Mechanic/Amaoe MZ-3 Stencil


₹ 69 ₹ 300 77% off


Precision MZ-3 stencil for accurate mobile PCB reballing work.

High-quality steel stencil for IC chip soldering and repair.

Ideal tool for professional smartphone motherboard rework.

Heat-resistant stencil ensures clean and perfect solder balls.

Designed for fast and efficient BGA reballing jobs.

Durable and reusable stencil for long-term repair use.

Perfect alignment holes for precise chip positioning.

Compact and lightweight stencil for easy handling.

Suitable for technicians and mobile repair professionals.

Reliable stencil for consistent soldering results every time.

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Description

Mechanic/Amaoe MZ-3 Stencil

The Mechanic/Amaoe MZ-3 is a professional-grade BGA reballing stencil meticulously engineered for the Samsung Galaxy S9, S9+, and Note 9 series. This stencil is a staple for micro-soldering technicians, specifically designed to handle both Exynos 9810 and Snapdragon 845 chipset architectures.

With its signature matte black anti-glare finish and high-precision square-hole layout, it ensures consistent solder ball formation while reducing technician eye fatigue under microscope lighting.

Technical Specifications

Feature Details
Brand Mechanic / Amaoe (Joint Venture Series)
Model MZ-3
Material Japanese High-Strength Stainless Steel
Surface Finish Matte Black Anti-Reflective Coating
Thickness 0.12mm (Industry standard for precision)
Hole Geometry Laser-Cut Square Holes (Prevents paste "sticking")
Primary Compatibility Samsung Galaxy S9 / S9 Plus / Note 9
Application BGA Reballing / IC Tin Planting / Motherboard Repair

Core Features & Benefits

The MZ-3 is distinguished by several engineering choices that elevate it above generic universal stencils:

  • Heat Stability: Manufactured to withstand repeated thermal cycles from hot air stations without warping or "drumming" (bulging).

  • Square Mesh Design: Unlike traditional round holes, the square-cut apertures provide better solder paste release, resulting in uniform solder balls and reducing the risk of bridges.

  • Black Coating Technology: The specialized black finish absorbs light, providing a high-contrast view of the silver IC pads, which is critical for alignment under a microscope.

  • 1:1 Precision: Holes are CNC laser-etched to match the original factory pad layout of the Samsung S9/Note 9 logic boards.

Detailed Component Compatibility

The MZ-3 is a comprehensive "all-in-one" solution for the S9 generation of devices, supporting a wide array of integrated circuits:

IC Category Supported Components
Processors (CPU) Samsung Exynos 9810 / Qualcomm Snapdragon 845
Memory (RAM) LPDDR4X / Stacked RAM modules
Power Management Main PMIC, Sub-PMIC, and Battery Charging ICs
Network & Signal Baseband CPU, RF Transceivers, WiFi/Bluetooth Modules
Storage (NAND) UFS 2.1 Flash Memory chips
Audio & Sensors Audio Codec, NFC Controller, and Display Driver ICs

Mechanic/Amaoe MZ-3 Stencil

 

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