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Mechanic/Amaoe MQ-1 Stencil


₹ 69 ₹ 300 77% off


Precision BGA reballing stencil designed for mobile phone PCB repair.

High-quality stainless steel stencil for accurate IC soldering work.

Perfect tool for chip reballing and motherboard repair tasks.

Ultra-thin stencil ensures clean and precise solder ball placement.

Durable and heat-resistant stencil for professional technicians.

Ideal for smartphone IC rework and soldering projects.

Reusable stencil with precise hole alignment for easy reballing.

Designed for fast, efficient, and reliable chip repair work.

Compact and lightweight stencil for daily repair shop use.

Essential repair tool for mobile technicians and electronics labs.

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Description

Mechanic/Amaoe MQ-1 Stencil

The Mechanic/Amaoe MQ-1 is a professional-grade BGA reballing stencil meticulously engineered for high-density smartphone chipsets. Part of the specialized MQ series, the MQ-1 is designed specifically to handle a variety of Qualcomm and MediaTek (MTK) Power ICs and CPUs, offering technicians a "multi-in-one" solution for power-related circuit repairs.

Technical Specifications Overview

Feature Details
Brand Mechanic / Amaoe (High-End Collaboration)
Model MQ-1 (Qualcomm/MTK Power IC Series)
Material Japanese Imported High-Tension Stainless Steel
Hole Design Precision Square Mesh (Anti-Clogging)
Thickness 0.12mm (Standard Gold Thickness for Reballing)
Hardness Super Hard / High Elasticity
Heat Resistance Up to 450°C (Prevents thermal bulging/warping)
Finish Polished Silver / Anti-Glare Surface

Supported Chipsets & Compatibility

The MQ-1 is a versatile stencil focusing on widely used chipsets found in mid-to-high-range Android devices (Xiaomi, Vivo, Oppo, Realme, etc.).

IC Type Specific Model Numbers Supported
Qualcomm Snapdragon SDM845, SDM710, SDM660, SDM845 RAM
MediaTek (MTK) MT6771V, MT6739V, MT6763V, MT6757V
Power Management PM8150, PM8350, and compatible Qualcomm PMICs
Functionality CPU Reballing, RAM Layering, and Power IC Rework

Core Features & Advantages

  • Anti-Bulge Engineering: Specifically designed to stay flat during the heating process. This "Anti-Drum" technology ensures the stencil doesn't pop up and bridge solder balls.

  • Square Hole Precision: Unlike circular holes that can trap solder paste, the square-cut apertures ensure a clean release of the IC after heating, resulting in perfectly uniform solder spheres.

  • High-Contrast Alignment: The stencil features clear laser-etched markings for each IC model, allowing technicians to align the chip pads under a microscope quickly and accurately.

  • Optimal Thickness (0.12mm): This specific thickness is the industry standard for modern mobile ICs, ensuring that solder balls are neither too small (leading to dry joints) nor too large (leading to shorts).

Best Practices for Professional Use

To ensure the longevity of your MQ-1 Stencil and achieve a 100% success rate:

  1. Paste Selection: Use high-quality solder paste with a consistent particle size (e.g., Mechanic M9/M10 183°C).

  2. Controlled Airflow: When reballing, use a lower airflow setting on your hot air station (e.g., 2–3 on a Quick 861DW) to prevent the stencil from vibrating.

  3. Chemical Cleaning: Clean the stencil immediately after use using 99% Isopropyl Alcohol (IPA) or specialized PCB cleaner. Never use a metal brush; use a soft-bristled nylon brush or lint-free cloth.

  4. Flat Storage: Store the stencil in its original protective sleeve or a magnetic storage book to prevent accidental bending.

Mechanic/Amaoe MQ-1 Stencil

Verified Reviews

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