Mechanic/Amaoe SAM-2 Stencil
Mechanic / Amaoe SAM-2 Stencil offers precise IC reballing for mobile motherboard repair.
High-quality steel stencil designed for accurate solder ball placement and durability.
Perfect tool for BGA reballing and professional mobile repair technicians.
Heat-resistant stencil ensures stable performance during high-temperature work.
Ultra-thin design provides precise alignment and clean soldering results.
Compatible with multiple smartphone IC repair applications.
Long-lasting build quality ideal for daily repair shop use.
Improves repair efficiency and reduces rework time.
Lightweight and easy to handle for quick IC reballing jobs.
Essential repair accessory for advanced motherboard maintenance.
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The Mechanic/Amaoe SAM-2 is a professional-grade BGA reballing stencil specifically engineered for the Samsung Galaxy S7 and S7 Edge series. This stencil is a staple for technicians performing chip-level repairs on the Exynos 8890 and Snapdragon 820 architectures, featuring the iconic square-hole design that has made Amaoe a leader in micro-soldering tools.
Technical Specifications Overview
| Feature | Details |
| Brand | Mechanic / Amaoe (Specialized SAM Series) |
| Model | SAM-2 (Samsung S7 / S7 Edge Dedicated) |
| Material | Japanese High-Tension Stainless Steel |
| Color/Finish | Silver Polished / Anti-Glare |
| Stencil Thickness | 0.12mm (Ultra-precision thickness) |
| Hole Design | Precision Square Mesh (prevents solder bridging) |
| Manufacturing | High-Speed Laser Cutting |
| Thermal Properties | High-temperature stability (Anti-warping) |
The SAM-2 is designed to cover the major IC components of the Samsung S7 generation logic boards.
| Category | Supported Models / ICs |
| Supported Devices | Samsung Galaxy S7 (G9300, G930F), S7 Edge (G9350, G935F) |
| Processors (CPU) | Exynos 8890 and Qualcomm Snapdragon 820 (MSM8996) |
| Memory (RAM) | Layered LPDDR4 RAM chips |
| Storage | UFS 2.0 / eMMC flash memory modules |
| Power Management | Main PMIC and Sub-PMIC for S7 series |
| Baseband/RF | Signal processors and RF Transceiver chips |
