Mechanic/Amaoe SAM-4 Stencil
Mechanic/Amaoe SAM-4 Stencil for precise and professional mobile PCB reballing.
High-quality steel stencil designed for accurate IC solder ball placement.
Perfect tool for BGA reballing and advanced smartphone motherboard repair.
Durable and heat-resistant stencil for long-lasting repair performance.
Ultra-precise cutouts ensure clean and consistent soldering results.
Ideal for technicians handling micro soldering and chip rework jobs.
Lightweight, compact, and easy to use for everyday repair tasks.
Designed for fast and efficient IC reballing with minimal effort.
Reliable repair accessory for professional mobile repair workshops.
Helps achieve stable solder joints and improved repair accuracy.
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The Mechanic/Amaoe SAM-4 is a specialized BGA reballing stencil meticulously engineered for Samsung's mid-range and legacy flagship series (A, J, and S series). While newer stencils like the SAM-12 focus on the latest S20/S21 series, the SAM-4 remains an essential "legacy workhorse" for technicians dealing with the high volume of Samsung A-series and J-series devices still in active circulation.
| Feature | Details |
| Brand | Mechanic / Amaoe (Professional Collaboration) |
| Model | SAM-4 |
| Material | Japanese Imported High-Tension Stainless Steel |
| Aperture Design | Precision Square Mesh (Prevents "Bridge" Soldering) |
| Thickness | 0.12mm (Ultra-precise for modern IC pitch) |
| Heat Resistance | Up to 450°C (Anti-warping/Anti-bulge technology) |
| Surface Finish | Polished Silver / Anti-Glare |
| Elasticity | High flexibility (Returns to shape after bending) |
Usage & Maintenance Tips
Paste Application: Use a high-quality solder paste (e.g., Mechanic V4B45 183°C). Apply with a firm, single-stroke scraper to avoid air bubbles.
Heating: Apply heat in a circular motion. Once the solder balls "shine" and settle, remove the heat immediately to avoid over-tempering the steel.
Cleaning: Clean with 99% IPA or Ultrasonic cleaner after every 2–3 uses. Dried solder paste in the square holes is the most common cause of reballing failure.

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