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Mechanic/Amaoe SAM-1 Stencil


₹ 69 ₹ 300 77% off


High-precision SAM-1 stencil for professional mobile PCB reballing.

Durable stainless steel design for long-lasting repair use.

Perfect alignment for accurate IC reballing results.

Heat-resistant stencil suitable for daily repair work.

Ideal tool for BGA reballing and chip repair tasks.

Compact and lightweight for easy workshop handling.

Designed for fast, clean and efficient solder ball placement.

Strong and reusable stencil for technicians and repair labs.

Ensures uniform solder ball distribution every time.

Essential tool for smartphone motherboard repair professionals.

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Description

Mechanic/Amaoe SAM-1 Stencil

The Mechanic/Amaoe SAM-1 is a high-precision BGA reballing stencil specifically engineered for the flagship generation of Samsung devices, primarily the Galaxy S8, S8+, and Note 8 series. It is a critical tool for technicians performing chip-level motherboard repairs, such as CPU transplants or fixing power-on issues.

Technical Specifications Overview

Feature Details
Brand Mechanic / Amaoe (Collaborative Professional Series)
Model SAM-1
Material Japanese Imported High-Tension Stainless Steel
Stencil Thickness 0.12mm (Ultra-precise for high-density BGA)
Hole Type Square-holed (Anti-bridge/Easy paste release)
Anti-Bulge Design Heat-resistant alloy to prevent thermal warping
Finish Matte Anti-Glare / Silver Polished
Hardness High Elasticity (Resistant to permanent deformation)

Detailed Chip Compatibility List

The SAM-1 is a multi-function stencil that covers the primary integrated circuits (ICs) for the Samsung 8-series flagship ecosystem, including both Global (Exynos) and US/China (Snapdragon) variants.

IC Category Components Supported
Processors (CPU) Qualcomm MSM8998 (Snapdragon 835) / Exynos 8895
Power Management PM8998, PMI8998, PM8005, MAX77838
Audio/Codec WCD9341 Audio IC
RF & Signal WTR5975 RF Transceiver, AFEM-9060, QM78038
Charging/USB SM5720, P9320S, and high-current Charging ICs
Memory Support LPDDR4 RAM (layered on CPU) & UFS 2.1 Storage chips

Professional Usage Guidelines

To ensure a 100% success rate during the reballing process:

  1. Preparation: Clean the IC surface thoroughly using a solder wick and flux cleaner. Any residual old solder will cause the stencil to sit unevenly.

  2. Paste Application: Use a medium-viscosity solder paste (e.g., Mechanic M9 183°C). Spread evenly with a firm scraper.

  3. Heat Control: Set your hot air station to approximately 330°C - 350°C with low airflow. Hold the stencil down with tweezers at the edges to ensure zero movement.

  4. Cleaning: After the solder balls have formed and cooled, clean the stencil immediately with 99% Isopropyl Alcohol. Do not let paste harden in the square holes.

Mechanic/Amaoe SAM-1 Stencil

Verified Reviews

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