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AMAOE 8GEN5 SM8845 STENCIL


₹ 149 ₹ 400 63% off


AMAOE 8GEN5 SM8845 stencil for precise chipset reballing repairs.

High-accuracy stencil designed for SM8845 CPU soldering applications.

Durable steel stencil ensures clean and consistent reballing results.

Professional repair stencil suitable for advanced mobile technicians worldwide.

Precision-cut openings provide accurate solder ball placement every time.

Reliable AMAOE stencil for efficient chipset maintenance and restoration.

Heat-resistant construction supports repeated use during repair procedures.

Ideal tool for SM8845 chip rework and reballing tasks.

Engineered for stable alignment and enhanced soldering performance quality.

Premium mobile repair stencil delivering precise and dependable results.

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Description

AMAOE 8GEN5 SM8845 STENCIL

The AMAOE 0.12mm CPU BGA Reballing Stencil for the Qualcomm SM8845 (Snapdragon 8 Gen 5) is a high-precision tool engineered for professional mobile motherboard repair and chip-level servicing. It is crafted from advanced, heat-resistant Japanese steel, ensuring durability and consistent performance during complex reballing procedures.

The table below outlines the full product specifications and technical features.

Product Specification: AMAOE SM8845 (Snapdragon 8 Gen 5) Stencil

Feature Specification / Detail
Product Name AMAOE 0.12mm CPU BGA Reballing Stencil
Compatibility Qualcomm SM8845 (Snapdragon 8 Gen 5) Chipset
Material High-Grade Japanese Stainless Steel
Thickness 0.12 mm (Optimized for precision solder flow)
Primary Use BGA (Ball Grid Array) Reballing and Solder Paste Application
Design Laser-etched, high-precision aperture pattern
Heat Resistance Engineered to withstand high-temperature rework cycles
Durability Deformation-resistant, designed for multiple reuse
Weight Approx. 0.02 kg
Application Method Compatible with solder paste or pre-formed solder balls
Cleaning Easy-clean surface finish for residue removal

Key Technical Advantages

  • High-Precision Alignment: The laser-etched apertures are perfectly aligned to the BGA pad layout of the SM8845 CPU, minimizing the risk of solder bridging or misalignment during the reballing process.

  • Optimal Thickness: At 0.12mm, the stencil provides the ideal depth to ensure a consistent, uniform volume of solder is deposited onto each pad, which is critical for the stability of high-performance flagship chipsets.

  • Professional Durability: The use of "super-hard" Japanese steel ensures the stencil does not warp or deform under the high thermal stress of hot-air rework stations, allowing it to maintain its integrity over extensive use.

  • Enhanced Workflow: By providing a perfectly matched template for the Snapdragon 8 Gen 5, this tool significantly reduces the time required for motherboard diagnostics and CPU-level repairs, helping technicians maintain high-quality, reliable repair standards.

AMAOE 8GEN5 SM8845 STENCIL

Verified Reviews

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