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AMAOE IPAD-M5 STENCIL


₹ 159 ₹ 400 60% off


AMAOE iPad M5 stencil ensures precise BGA reballing repairs.

High-accuracy stencil designed for professional iPad motherboard servicing tasks.

Durable steel construction provides reliable chip reballing performance daily.

Precision-cut openings deliver accurate solder ball placement every time.

Ideal for technicians repairing iPad logic boards and ICs.

Reusable stencil offers consistent results during multiple repair sessions.

Supports efficient chipset rework with clean solder alignment accuracy.

Professional-grade stencil enhances repair quality and technician productivity greatly.

Engineered for stable positioning during advanced motherboard repair work.

Compact and durable design suitable for workshop and field.

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Only 4 Product left!

Description

AMAOE IPAD-M5 STENCIL

The AMAOE IPAD-M5 Stencil is a high-precision BGA (Ball Grid Array) reballing tool designed specifically for professional electronics technicians performing chip-level repairs on Apple iPad logic boards.

It serves as a critical template for the precise application of solder paste onto the contact pads of complex processors and integrated circuits (ICs), including the M-series chips. By ensuring accurate alignment, it prevents solder bridging and helps restore the functionality of devices that have suffered from failed or damaged chips.

Product Specification Table

Feature Specification Details
Product Name AMAOE iPad-M5 BGA Reballing Stencil
Primary Function Precision solder paste application & BGA reballing
Material High-quality, durable stainless steel
Compatibility Specific iPad models (M5/M-series architectures/Air/Pro series)
Thickness Typically 0.12mm – 0.15mm (optimized for flow)
Precision Tolerance ±0.01mm
Design Laser-cut apertures for exact chip pin alignment
Thermal Resistance High-temperature resistant (prevents warping/deforming)
Reusability Highly durable; supports repeated use with proper cleaning
Application CPU, NAND, Power IC, Audio IC, and RAM reballing
Key Benefit Eliminates solder bridges; ensures stable, reliable rework

Key Product Highlights

  • Professional Precision: Engineered with high-accuracy laser cutting, the stencil ensures that every solder ball is placed exactly where the micro-bumps on the chip are located.

  • Durable Construction: Crafted from premium stainless steel, the stencil is designed to withstand the repeated heat and pressure cycles of professional rework stations without losing its structural integrity.

  • Workflow Efficiency: By simplifying the alignment process, this tool significantly reduces the time required for complex motherboard repairs and lowers the risk of human error during micro-soldering tasks.

  • Versatile Utility: While tailored for M-series chips, the AMAOE stencil series is an essential component for any technician’s toolkit, frequently used alongside reballing platforms to handle delicate components like the CPU, RAM, and power management ICs

AMAOE IPAD-M5 STENCIL

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