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AMAOE M5 CPU STENCIL


₹ 249 ₹ 600 59% off


AMAOE M5 CPU stencil ensures precise chip reballing alignment work.

Durable steel stencil designed for accurate CPU solder ball placement.

High-precision AMAOE M5 stencil supports professional motherboard repair tasks.

Perfect CPU reballing stencil for mobile phone repair technicians.

Reliable stencil template delivers clean and consistent soldering results.

Precision-cut openings provide accurate solder ball positioning every time.

AMAOE M5 stencil ideal for advanced chipset repair applications.

Heat-resistant steel construction ensures long-lasting repair workshop performance.

Professional CPU stencil helps improve efficiency during rework processes.

Compact reballing stencil offers stable alignment for chip repairs.

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Description

AMAOE M5 CPU STENCIL

The AMAOE M5 series (often referred to as MU-5 or related variants) is a professional-grade, high-precision BGA (Ball Grid Array) reballing stencil. It is engineered specifically for technicians involved in advanced smartphone motherboard repairs, focusing on MediaTek (MTK) and, in some variants, Qualcomm chipsets.

These stencils are essential for "reballing"—the process of replacing the solder balls on the underside of a CPU or IC (Integrated Circuit) to ensure a secure, functional connection to the motherboard.

AMAOE M5 Series: Technical Overview

Feature Specification Details
Brand AMAOE
Primary Material High-Quality Stainless Steel (Super-hardened)
Thickness 0.12 mm (Industry standard for precision flow)
Compatible Chipsets MediaTek (MTK) Dimensity/Helio series; certain variants support Qualcomm
Aperture Technology Laser-cut, half-etched micro holes
Key Function BGA Reballing and Solder Paste Application
Thermal Resistance High-temperature resistant (prevents warping during rework)
Design Type Square/Round hole alignment for uniform solder distribution
Reusable Yes, designed for multiple rework cycles
Primary Application Smartphone CPU/RAM IC repair and motherboard refurbishment

Usage Instructions

  1. Alignment: Secure the CPU/IC and align the stencil apertures precisely with the chip's solder pads.

  2. Paste Application: Apply a thin layer of high-quality solder paste over the stencil using a precision scraper or blade.

  3. Reflow: Apply controlled heat using a hot air rework station. The high-temperature resistant properties of the AMAOE steel ensure the stencil does not lift or warp, keeping the solder balls in place during the reflow process.

  4. Cleaning: Once cooled, carefully lift the stencil and clean with a suitable solvent to remove any excess flux or solder debris.

AMAOE M5 CPU STENCIL

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