AMAOE MAC 11 STENCIL


₹ 249 ₹ 600 59% off


AMAOE MAC 11 stencil ensures precise reballing for technicians daily.

High-quality stencil designed for accurate IC soldering and repairs.

Durable steel construction provides long-lasting performance during rework tasks.

Precision-cut openings deliver consistent solder ball alignment every time.

Ideal stencil solution for professional mobile motherboard repair projects.

AMAOE MAC 11 supports efficient chip reballing with accuracy.

Reliable repair tool for technicians handling complex board repairs.

Engineered for smooth solder application and reduced repair errors.

Professional-grade stencil enhances productivity in electronics repair workshops.

Perfect choice for accurate IC reballing and maintenance work.

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Description

AMAOE MAC 11 STENCIL

 

The AMAOE MAC11 Stencil is a professional-grade, high-precision BGA (Ball Grid Array) reballing tool specifically engineered for Apple notebook CPUs. It is part of the AMAOE "M3 CPU Universal Series," designed to assist technicians in the intricate process of chip-level motherboard repair.

Below is the detailed product description in tabular format.

Product Overview: AMAOE MAC11 Stencil

Feature Description
Product Name AMAOE MAC11 M3 CPU Universal Series BGA Reballing Stencil
Primary Application BGA reballing and IC rework for Apple notebook CPUs
Material High-grade, heat-resistant stainless steel
Stencil Thickness 0.12mm (optimized for balance between flexibility and rigidity)
Manufacturing Tech Advanced precision laser-cut technology
Reusability Fully reusable; designed to withstand repeated high-temperature cycles
Compatibility M3 CPU series (Apple Notebook) and specific logic board layouts
Key Benefits Prevents solder bridging, ensures uniform solder ball size, and guarantees alignment

Key Technical Specifications & Functional Details

Technical Aspect Details
Aperture Design Precisely aligned holes that match the exact layout of BGA solder pads
Heat Resistance Engineered to resist warping/deformation during high-heat soldering/reballing
Soldering Mediums Compatible with standard solder paste and leaded/lead-free solder balls
Operational Goal Enables consistent, professional-grade connections on high-density circuits
Handling Lightweight and thin, allowing for easy placement and removal during the rework process

AMAOE MAC 11 STENCIL

 

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