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AMAOE R8A77860 STENCIL


₹ 249 ₹ 600 59% off


Precision AMAOE R8A77860 stencil for accurate BGA reballing work.

Durable steel stencil ensures clean and reliable chip repairs.

High-quality stencil designed for professional mobile repair technicians.

Accurate hole alignment for efficient solder ball placement tasks.

Reusable stencil with strong construction for long-term workshop use.

Ideal tool for chipset reballing and motherboard repair jobs.

Fine precision design delivers consistent soldering repair results.

Professional-grade stencil suitable for advanced mobile repair applications.

Heat-resistant stencil supports stable and precise rework performance.

Compact repair stencil offering accuracy, durability, and convenience.

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Description

AMAOE R8A77860 STENCIL

The AMAOE R8A77860 Stencil is a professional-grade precision tool designed specifically for motherboard repair technicians working with Renesas automotive and embedded system chips. Engineered for high-accuracy tin planting and BGA (Ball Grid Array) reballing, this stencil ensures consistent, reliable connections, making it an essential component for complex logic board restoration.

Technical Specifications

Feature Details
Product Brand AMAOE
Model Compatibility Renesas R8A77860 (SH-4A Series Microprocessor)
Material High-Quality Heat-Resistant Steel
Thickness Optimized for Precision (typically 0.12mm - 0.20mm)
Application BGA Reballing, Solder Mask Repair, Tin Planting
Package Contents 1 x Professional BGA Stencil
Compatibility Automotive ECU, Embedded Systems, Logic Boards
Resilience High-temperature resistance, anti-deformation, anti-corrosion

Key Features & Benefits

Benefit Description
Precision Alignment Designed for exact hole-to-pad alignment, preventing bridging and shorts during the reballing process.
Durable Construction Made from high-grade steel that resists warping even under repeated thermal cycling.
Ease of Use Uniform aperture sizes ensure consistent solder ball distribution for professional finish.
Repair Efficiency Drastically reduces manual repair time for complex IC chip restoration tasks.
Versatility Ideal for both leaded and lead-free solder paste applications.

Usage Guidelines for Technicians

Step Action Best Practice
1. Preparation Clean the IC chip surface thoroughly. Use high-quality IPA (Isopropyl Alcohol) to remove oxidation.
2. Positioning Place the chip accurately under the stencil aperture. Use a high-magnification microscope for perfect pad-to-hole alignment.
3. Paste Application Apply a thin, even layer of solder paste. Use a metal scraper to ensure a smooth, level finish across the stencil.
4. Heating Apply controlled heat using a hot air rework station. Maintain stable airflow to prevent stencil lifting or solder splatter.
5. Post-Process Gently lift the stencil once the solder cools. Ensure the stencil is cleaned immediately to prevent flux/solder buildup.

AMAOE R8A77860 STENCIL

 

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