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AMAOE BGA2138 STENCIL


₹ 159 ₹ 400 60% off


Precision BGA2138 stencil for accurate chip reballing.

Durable steel stencil ensures consistent solder alignment.

Professional reballing stencil for mobile repair technicians.

High precision openings deliver flawless solder balling.

Heat resistant stencil supports reliable repair performance.

Reusable BGA2138 stencil with premium stainless construction.

Perfect alignment stencil for advanced motherboard repairs.

Engineered for precise BGA chip rework applications.

Premium reballing stencil enhances repair accuracy consistently.

Reliable BGA2138 stencil for professional electronics servicing.

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Description

AMAOE BGA2138 STENCIL

Product Description

The AMAOE BGA2138 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC chip repair. Manufactured from premium stainless steel, this stencil provides exceptional durability, accurate alignment, and consistent solder ball placement for efficient BGA reballing.

Its precision laser-cut openings ensure smooth soldering while reducing alignment errors, making it suitable for technicians repairing smartphones, tablets, and electronic devices. The stencil is reusable, heat-resistant, corrosion-resistant, and ideal for professional repair labs and service centers.

Whether you're replacing damaged ICs or performing advanced motherboard repairs, the AMAOE BGA2138 Stencil delivers reliable performance, precise solder ball positioning, and long-lasting durability.

 

Specifications Table

Specification Details
Brand AMAOE
Model BGA2138
Product Type BGA Reballing Stencil
Material Premium Stainless Steel
Manufacturing Precision Laser Cut
Application Mobile Phone Motherboard Repair
Compatible Devices Smartphones, Tablets, Electronic Boards
Heat Resistance Yes
Reusable Yes
Corrosion Resistant Yes
Precision Alignment High Accuracy
Usage IC Chip Reballing

Features

  • High-quality stainless steel construction
  • Precision laser-cut BGA openings
  • Accurate IC chip alignment
  • Heat and corrosion resistant
  • Reusable professional repair stencil

Benefits

  • Produces accurate solder ball placement
  • Reduces repair time and alignment errors
  • Improves successful IC reballing
  • Suitable for repeated professional use
  • Ideal for advanced motherboard repairs

5 Bullet Points

  • Premium stainless steel precision reballing stencil.
  • Accurate laser-cut openings for IC repair.
  • Durable, reusable, and heat resistant.
  • Professional quality for motherboard servicing.
  • Perfect for mobile phone BGA rework.

AMAOE BGA2138 STENCIL

 

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