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AMAOE G996B-012 S21+ SM-G996B/F/BR_S STENCIL


₹ 259 ₹ 600 57% off


Precision stencil for Samsung S21+ motherboard reballing.

Durable steel stencil ensures accurate BGA repairs.

Professional reballing template for flawless solder alignment.

High precision stencil supports efficient chipset rework.

Reusable BGA stencil for reliable repair performance.

Laser cut design delivers consistent soldering accuracy.

Compatible with Samsung G996B motherboard chip repairs.

Heat resistant stencil built for repeated usage.

Perfect alignment improves mobile motherboard repair quality.

Essential repair stencil for professional technician workflows.

1

Description

AMAOE G996B-012 S21+ SM-G996B/F/BR_S STENCIL

Product Description

The AMAOE G996B-012 S21+ SM-G996B/F/BR_S Stencil is a high-precision BGA reballing stencil specially designed for Samsung Galaxy S21+ (SM-G996B, SM-G996F, SM-G996BR) motherboard repair. Manufactured from premium stainless steel using precision laser cutting, this stencil provides accurate solder ball alignment for CPU, IC, and chipset reballing.

Designed for professional mobile repair technicians, the AMAOE stencil offers excellent heat resistance, long-lasting durability, and consistent soldering performance. Whether you're repairing damaged ICs, replacing chips, or performing motherboard maintenance, this stencil ensures reliable and precise results while reducing repair time.

Ideal for repair shops, service centers, and advanced technicians, the AMAOE G996B-012 delivers professional-quality reballing for Samsung Galaxy S21+ motherboard repairs.

Specifications

Specification Details
Brand AMAOE
Model G996B-012
Product Type BGA Reballing Stencil
Compatible Device Samsung Galaxy S21+
Compatible Models SM-G996B, SM-G996F, SM-G996BR
Material Premium Stainless Steel
Manufacturing High Precision Laser Cutting
Application CPU & IC Reballing
Heat Resistance High Temperature Resistant
Reusable Yes
Usage Mobile Phone Motherboard Repair

Features

  • Precision laser-cut stainless steel construction.
  • Accurate BGA solder ball alignment.
  • Designed specifically for Samsung Galaxy S21+.
  • High-temperature resistant for repeated usage.
  • Durable, reusable, and professional-grade quality.

Benefits

  • Delivers precise and reliable IC reballing.
  • Reduces soldering errors during repairs.
  • Improves motherboard repair efficiency.
  • Long-lasting stencil for repeated professional use.
  • Suitable for repair shops and technicians.

 

5 Bullet Points

  • Precision laser-cut stainless steel BGA stencil.
  • Designed for Samsung Galaxy S21+ motherboard repair.
  • Accurate IC, CPU and chipset reballing.
  • High-temperature resistant and reusable construction.
  • Professional repair tool for mobile technicians.

 

Meta Description

Buy AMAOE G996B-012 Samsung Galaxy S21+ SM-G996B/F/BR_S BGA reballing stencil for accurate CPU, IC, and motherboard repair. Premium stainless steel, reusable, precision laser-cut design.

AMAOE G996B-012 S21+ SM-G996B/F/BR_S STENCIL

 

Verified Reviews

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