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AMAOE WXCC-3 STENCIL


₹ 259 ₹ 600 57% off


Precision stencil for accurate mobile IC reballing.

Durable stainless steel stencil for professional repairs.

High accuracy laser cut BGA repair template.

Reliable stencil for motherboard chip soldering tasks.

Professional IC repair stencil with precise alignment.

Heat resistant reusable stencil for electronics repairs.

Ideal solution for mobile motherboard reballing applications.

Premium repair stencil offering consistent solder ball placement.

Designed for accurate smartphone IC repair projects.

Trusted AMAOE stencil for expert repair technicians.

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Description

AMAOE WXCC-3 STENCIL

Product Description

The AMAOE WXCC-3 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC chip repair. Manufactured from premium stainless steel, it offers excellent heat resistance, accurate hole positioning, and long-lasting durability for repeated use. The stencil ensures uniform solder ball placement, making it ideal for CPU, NAND, PMIC, and other BGA IC reballing applications.

Suitable for professional repair technicians and electronics workshops, the AMAOE WXCC-3 helps improve repair accuracy, reduce soldering errors, and increase repair efficiency. Compatible with hot air rework stations, solder paste, solder balls, and microscope-assisted repair work.

Specifications

Specification Details
Brand AMAOE
Model WXCC-3
Product Type BGA Reballing Stencil
Material Premium Stainless Steel
Application Mobile Phone IC Repair
Compatibility CPU, NAND, PMIC & BGA ICs
Heat Resistance High Temperature Resistant
Reusable Yes
Precision High Accuracy Laser Cut
Usage Mobile Phone Motherboard Repair

Features

  • High-quality stainless steel construction
  • Precision laser-cut stencil openings
  • Excellent heat and corrosion resistance
  • Accurate BGA solder ball alignment
  • Reusable professional repair stencil
  • Ideal for motherboard IC reballing
  • Suitable for repair laboratories
  • Lightweight and durable design
  • Smooth polished surface finish
  • Compatible with hot air rework stations

Benefits

  • Improves IC reballing accuracy
  • Saves repair time
  • Reduces soldering mistakes
  • Ensures consistent solder ball placement
  • Increases repair success rate
  • Long-lasting professional quality
  • Suitable for repeated daily use
  • Supports precision motherboard repair
  • Easy to clean after use
  • Ideal for mobile repair technicians

 

5 Bullet Points

  • Premium stainless steel precision reballing stencil.
  • Accurate laser-cut openings for IC repair.
  • High heat resistance for professional usage.
  • Reusable design with excellent durability.
  • Ideal for mobile motherboard repair technicians.

 

Meta Description

Buy the AMAOE WXCC-3 Stencil for professional BGA IC reballing and mobile motherboard repair.Precision stainless steel template for accurate solder ball placement with fast shipping across India

AMAOE WXCC-3 STENCIL

Verified Reviews

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