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MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID


₹ 3598 ₹ 8000 55% off


Professional magnetic platform for precise BGA motherboard repairs.

Dual-sided magnetic fixture improves chip alignment accuracy.

Securely holds smartphone PCBs during soldering repairs.

Ideal platform for iPhone motherboard reballing applications.

Supports Android PCB repair with stable positioning.

Durable metal construction withstands repeated repair operations.

High precision fixture for professional repair technicians.

Stable magnetic design reduces motherboard movement significantly.

Perfect tool for CPU and NAND reballing.

Reliable repair platform for advanced electronics technicians.

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Description

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

Product Description

The MECHANIC MAGTIN MAX Magnetic Dual-Sided BGA Reballing Platform Set is a professional-grade repair tool designed for accurate BGA IC reballing, chip positioning, and PCB maintenance. Featuring a strong magnetic dual-sided platform, it securely holds iPhone and Android motherboards during soldering and rework operations. The precision alignment system improves repair efficiency while minimizing movement during delicate chip replacement.

Made from high-quality heat-resistant metal, the MAGTIN MAX provides excellent durability for continuous professional use. Its dual-sided design supports multiple board layouts, making it compatible with a wide range of smartphones. Whether you're replacing CPU, NAND, PMIC, WiFi IC, or performing motherboard-level repairs, this platform delivers stable positioning for accurate BGA reballing.

Ideal for professional mobile repair technicians, electronics workshops, and service centers, the MECHANIC MAGTIN MAX helps improve repair quality, reduce errors, and increase productivity.

Specifications

Specification Details
Brand MECHANIC
Model MAGTIN MAX
Product Type Magnetic Dual-Sided BGA Reballing Platform
Compatibility iPhone & Android Motherboards
Material High-Strength Metal Alloy
Design Dual-Sided Magnetic Platform
Function PCB Holding & BGA Reballing
Heat Resistant Yes
Usage Mobile Phone Motherboard Repair
Application CPU, NAND, PMIC, BGA IC Repair

Features

  • Strong magnetic dual-sided motherboard holding system.
  • Precision alignment for accurate BGA chip positioning.
  • Compatible with most iPhone and Android PCBs.
  • Durable heat-resistant metal construction.
  • Professional platform for motherboard repair technicians.

Benefits

  • Improves BGA reballing accuracy.
  • Prevents motherboard movement during repair.
  • Speeds up professional repair workflow.
  • Supports multiple smartphone motherboard models.
  • Long-lasting tool for everyday workshop use.

 

5 Bullet Points

  • Strong magnetic dual-sided motherboard repair platform.
  • Accurate BGA chip alignment for professionals.
  • Compatible with iPhone and Android devices.
  • Heat-resistant durable metal construction design.
  • Ideal for mobile motherboard repair workshops.

 

Meta Description

Buy MECHANIC MAGTIN MAX Magnetic Dual-Sided BGA Reballing Platform for iPhone and Android motherboard repair. Precision magnetic PCB holder for professional BGA IC reballing and chip repair.

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

MECHANIC MAGTIN MAX MAGNETIC DUAL-SIDED BGA REBALLING PLATFORM SET FOR IPHONE / ANDROID

Verified Reviews

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