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Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair


₹ 234 ₹ 400 42% off


1. A low temperature lead-free solder paste customized for high-end motherboard repair

2. Tin lighting / climbing tin strong / high purity / temperature standard / easy to store

3. Low temperature tin paste melting point temperature

4. Low melting point

5. Effective protection of circuit board components

6. Backed by value tin technology

7. Not only the skilled craftsmanship, but also need

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Description

Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

 

RELIFE RL-404 Lead-free Solder Paste Low-Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

RELIFE RL-404 138° Soldering Paste is a specialized soldering paste with a 138° melting point, designed for efficient and reliable electronic soldering applications.

  • Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo, Redmi and Apple, etc. high-end machines
  • A low-temperature lead-free solder paste customized for high-end motherboard repair
  • RL-404 138 ° C low-temperature solder paste

 

 

Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA RepairRelife RL-404 138°C Soldering PasteRelife RL-404 138°C Soldering PasteRELIFE RL-404 138° SOLDERING PASTE 4RELIFE RL-404 138° SOLDERING PASTE 5

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