RELIFE RL SP-X SOLDERING PASTE
* THIS IS PERFECT FOR MOBILE PHONES, LAPTOPS, GAMING CONSOLES BGA SMT APPLICATIONS.
* SPECIALLY DESIGNED FORMULA FOR TEMPERATURE-CRITICAL REPAIRS.
* 158-DEGREE MELTING POINT.
* BEST FOR IPHONE X/XS/XS MAX MIDDLE LAYER.
* EXCELLENT WETTING COMPATIBILITY.
* VISCOSITY: 178 +/-10,
* VOLUME: 50G,
* ALLOY : SN63/PB37
1
Basic Features
SPECIAL SOLDERING FOR IPHONE X / XS / XSM TABLETS
Features:
1. 100% New Product
2. Warranty of 1 Month (Spare) and 3 months (Tool) for manufacturing defects
3. Safe packaging against transportation damage
4. Shipping insurance against loss
5. Express delivery
Packing Details: