MEGA-IDEA BZ-06 BLACK STENCIL FOR HONOR/HUAWEI


₹ 175 ₹ 500 65% off


1

Description

MEGA-IDEA BZ-06 BLACK STENCIL FOR HONOR/HUAWEI

 

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

 

SUPORTED MODEL:-

  • Kirin 910T CPU
  • HI6620 CPU 
  • HUAWEI P7

MEGA-IDEA BZ-06 BLACK STENCIL FOR HONOR/HUAWEI

Verified Reviews

Related Products

MECHANIC S24-82 STENCIL

₹ 69 ₹ 300
77% off    

1

SM5703A IC

₹ 37.00 ₹ 90
59% off    

1

BQ25896 IC ORIGINAL

₹ 138.00 ₹ 158
13% off    

1

iPhone 11/11pro/11pro max BB PUM PMB6840 (ORIGINAL) IC

₹ 91.00 ₹ 150
39% off    

1

SM5720 IC for Samsung S8 Plus Power Management

₹ 215 ₹ 700
69% off    

1

Amaoe PM-3 Stencil for Qualcomm PM Power

₹ 143 ₹ 400
64% off    

1

PM670 IC

₹ 44 ₹ 65
32% off    

1

NT50568 ORIGINAL IC

₹ 77.00 ₹ 200
62% off    

1