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MECHANIC QC-20 GLUE REMOVING LIQUID


₹ 219.00 ₹ 300 27% off


* 20ml BGA IC glue epoxy remover

* Quickly soften and loosen solidified resin adhesive such as epoxy

* Acrylate, polyurethane, organosilicon, etc.

* Environment-friendly and safe

Out of Stock

Description

MECHANIC QC-20 GLUE REMOVING LIQUID

 

MECHANIC QC-20 Glue Removing LIQUID BGA IC Adhesive Epoxy Remover Cell Phone CPU Chip Cleaner 20ml BGA-IC Repair Remove Liquid

1. 20ml BGA IC Epoxy Glue Remover.

2. It can help you soften and remove the resining/sealing glue of mobile phone BGA IC chip easily.

3. It can quickly soften and loosen solidified resin adhesives such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.

4. Will not damage your circuit board and components. Environmentally friendly and safe.

5. Does not contain any co-derivative substance of benzene with cause of leukemia. comfortable to wear

 

 

How to Use:

  • 1. Pick a bigger size absorbent cotton than BGA IC with tweezers and dip it into the removing liquid. Then cover it evenly on the BGA IC chip which needs glue removal.
  • 2. Place a plastic bag or film on the top and cover the PCB board.
  • 3. Wait for about 20 minutes.
  • 4. Redo step 1 to step 3.
  • 5. To remove the softened sealing glue in the outside of the BGA IC chip with tweezers. Please pay attention to avoid damaging routes surrounding the BGA and copper foil circuit the main board when removing the glue.
  • 6. Heat the chip with an air tool (300 deg.C). The glue in the bottom will melt and soften by heat.
  • 7. To remove the chip with a tweezers or cutter

MECHANIC QC-20 GLUE REMOVING LIQUID 1MECHANIC QC-20 GLUE REMOVING LIQUID 2

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