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RELIFE RL-601W PLANTING KIT


₹ 1998.00 ₹ 3000 33% off


Precision planting kit for BGA IC repairs.

Professional motherboard solder ball positioning repair solution.

Accurate IC reballing tool for technicians worldwide.

Reliable solder planting kit for PCB maintenance.

Durable repair accessory for electronic motherboard servicing.

High precision mobile phone IC planting equipment.

Essential BGA repair toolkit for professionals daily.

Quality reballing helper improves repair efficiency significantly.

Perfect motherboard repair tool with accurate alignment.

Advanced planting kit for precision solder placement.

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Only 1 Product left!

Description

RELIFE RL-601W PLANTING KIT

Product Description

The RELIFE RL-601W Planting Kit is a professional precision tool designed for accurate BGA IC solder ball planting and reballing during mobile phone motherboard repair. Engineered for technicians and electronics repair professionals, this kit helps position solder balls quickly and accurately, reducing errors and improving repair efficiency.

Manufactured using premium-quality materials, the RL-601W offers excellent durability, precision alignment, and comfortable handling. It is suitable for repairing iPhone, Android smartphones, tablets, laptops, gaming consoles, and various PCB motherboards requiring BGA chip reballing.

Whether you're replacing CPU, NAND, PMIC, Baseband, or other BGA ICs, the RELIFE RL-601W Planting Kit delivers reliable performance for professional repair shops, service centers, and advanced DIY technicians.

Specifications

Specification Details
Brand RELIFE
Model RL-601W
Product Type BGA IC Planting Kit
Application Solder Ball Planting & IC Reballing
Material Premium Metal + Precision Components
Compatibility Mobile Phones, Tablets, Laptop Motherboards
Usage PCB Motherboard Repair
Precision High Accuracy Positioning
Reusable Yes
Professional Grade Yes

Features

  • High-precision solder ball planting tool
  • Designed for professional BGA reballing
  • Durable premium-quality construction
  • Accurate IC alignment for better repairs
  • Suitable for multiple motherboard repairs

Benefits

  • Improves solder ball placement accuracy
  • Reduces repair time significantly
  • Minimizes soldering mistakes
  • Increases motherboard repair success rate
  • Ideal for professional repair technicians

5 Bullet Points

  • Precision BGA solder ball planting for accurate repairs.
  • Professional-grade kit for motherboard reballing applications.
  • Durable construction ensures long-lasting workshop performance.
  • Compatible with various mobile phone motherboard repairs.
  • Essential repair tool for electronics technicians worldwide.

 

RELIFE RL-601W PLANTING KIT

RELIFE RL-601W PLANTING KIT

RELIFE RL-601W PLANTING KIT

RELIFE RL-601W PLANTING KIT 1RELIFE RL-601W PLANTING KIT 2RELIFE RL-601W PLANTING KIT

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