AMAOE MAC-7 For MACBOOK
Designed for MacBook Pro A2159 – Compatible with T2 RAM, CD3215B03, CB3217B12, and other key ICs
Durable Stainless Steel Build – Withstands high heat and repeated use
Ultra-Thin 0.12?mm Thickness – Ensures clean and precise solder ball application
Square Aperture Design – Perfect alignment with chip pads prevents overflow
Reusable Tool – Ideal for multiple reballing jobs, saving time and cost
Perfect for Logic Board Repair – Essential for MacBook BGA soldering work
Professional Repair Standard – Trusted by technicians for reliable results
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Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.
Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.
Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.
SUPPORTED MODEL:
