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Mechanic XG-Z40 35G 183°c Solder Paste


₹ 179 ₹ 300 40% off


* Composition: Sn-63%, Pb-37%

* Solder particle size: 24 - 45 µm

* Flux type: No Clean

* Melting point: 200°C

* Residues do not require cleaning

* Easily washed off with alcohol-based products

* Packing: Composition: Sn-63%, Pb -37%

* Solder particle size: 24 - 45µm

* Packing: 35grmm (10ml)

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Description

Mechanic XG-Z40 35G 183°c Solder Paste

 

Solder paste Mechanic XGZ40, 10ml, is designed for soldering BGA chips. Convenient packaging in the form of a syringe will allow you to use the paste without prior preparation immediately. Solder pastes are widely used in electronics for mounting planar (SMD) components on a printed circuit board. Special solder pastes have found application in the installation of copper and brass pipes and fittings in water supply systems.
The main advantage of the paste is the ease of mechanization of work. The paste is applied with special dispensers or stencil methods. The paste can be applied in an even, precise layer by mechanized and automated means, resulting in significant solder savings.

  1. Composition: Sn-63%, Pb-37%
  2. Solder particle size: 24 - 45 µm
  3. Flux type: No Clean
  4. Melting point: 200°C
  5. Residues do not require cleaning
  6. Easily washed off with alcohol-based products
  7. Packing: Composition: Sn-63%, Pb -37%
  8. Solder particle size: 24 - 45µm
  9. Packing: 35grmm (10ml)

 

Packing Details:

  • * 1xMECHANIC XG-Z40 [35G] 183°C SOLDER PASTE

Mechanic XG-Z40 35G 183°c Solder Paste

 

Mechanic XG-Z40 35G 183°c Solder Paste

 

Mechanic XG-Z40 35G 183°c Solder PasteMECHANIC XG-Z40 [35G] 183°C SOLDER PASTE 2

MECHANIC XG-Z40 [35G] 183°C SOLDER PASTE 3

 

 

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