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SUNSHINE SS-T12A CPU MOULD


₹ 2048.00 ₹ 3000 32% off


  • ???? High-Precision Heating Plate – Ensures even temperature distribution for safe CPU removal.

  • Fast Heat-Up Time – Quickly reaches working temperature for faster workflow.

  • Accurate Temperature Control – Prevents overheating and protects delicate ICs.

  • Smart Temperature Protection System – Maintains consistent heat automatically.

  • Durable Aluminum Alloy Build – Strong, heat-resistant body ensures long service life.

  • Anti-Slip Base Design – Provides stability and safety during chip heating.

  • Perfect for Chip-Level Repairs – Ideal for CPU, IC, NAND, and eMMC work.

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Only 2 Product left!

Description

SUNSHINE SS-T12A CPU MOULD

  1. Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis 
  2. of IP-X solder paste ,but  depends on the special heating design and precise temperature control of SS-T12A.
  3.  SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
  4.  Dual bayonet design, make sure the IP-X motherboard is stable on the stage.
  5.  High purity copper is used as a film to ensure uniform heat transfer and heat.
  6. T12A-CPU:For iPhone 6-8plus cpu layering, motherboard de-gluing aid, needs to be used with

SUNSHINE SS-T12A CPU MOULD 1

 

 

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