2UUL SC92 189C SNK SOLDER PASTE
* Medium viscosity, not easy to move
* Bright and full spot, no residue
* Good wettability with excellent welding performance
* Melting Point: 189°C
* Micron (Aµm) Range: 20 – 38µm
* Viscosity: 178 +/-10
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Feature:
1. 2UUL SC92 189°C SNK Solder Paste 189°C Low-Temperature Tin Paste Welding Treatment for Mobile Phone BGA Chip Repair Items are ready to ship, not pre-order, sent every afternoon at 16.00 WIB Monday – Saturday
2. The condition of the item can be seen in the photos, we provide it as it is. Which is obtained according to the photo.
3. This is specifically for the iPhone X series of layered motherboards with superior performance.
4. 100% Brand New and High quality
5. This is especially for iPhone X / XR / Xs / Xs Max of layered motherboards with a better performance
6. Specially designed for high-end smartphones in the communications industry
Packing Details: