Liulon XG50 183°C Solder Paste 35G
*Material: plastic + soldering paste.
*Color: as shown in the picture
*Type: LIULON XG-50, 35g
*Application: For iron soldering station flux cream with BGA motherboard.
*Function: repair of mobile phone chips, computer and digital services industries, high-precision circuit board SMT welding, BGA welding process, etc.
*Storage conditions: 0-10 °C.
Out of Stock
Description:
1. LIULON XG50 Series 183? Leaded Solder Tin Paste
2. High-end quality, a unique formula, perfect performance.
3. Suitable for various welding environments, and a wide range of applications, with high compatibility.
4. The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn63/Pb37) makes the adhesion long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
5. The residue is colorless and transparent, does not affect the detection, is disposable, and has excellent cleaning performance.
6. Professional in cream for BGA mechanical lead-free welding flux paste for BGA soldering station.
7. Soldering paste, 183 °C, melting point grade, easy welding, easy molding.
Packing Details:







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