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AMAOE 11U-012 For Mi 11 ULTRA / Mi 11PRO MIDDLE LAYER MOTHERBOARD REBALLING


₹ 145 ₹ 400 64% off


  • Precision middle-layer BGA reballing stencil tailored for Mi 11 Ultra and Mi 11 Pro

  • Made from super?hard Japanese steel, ensuring durability and reuse 

  • 0.12?mm thickness for accurate solder paste deposition 

  • Designed with square aperture holes, precisely matching the BGA pad layout 

  • Reusable design supports multiple reballing operations

  • Part of a standardized series (11U?012) recognized among Xiaomi mid?layer BGA stencils measuring typically 70?×?70?mm

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Description

AMAOE 11U-012 For Mi 11 ULTRA / Mi 11PRO MIDDLE LAYER MOTHERBOARD REBALLING

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.


Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.


Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.


Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.


Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.



AMAOE 11U-012 11 ULTRA/ 11 PRO STENCIL

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