MECHANIC Q60 ANTIOXIDANT FLUX PASTE
* Type: No-clean flux paste, suitable for various electronic soldering applications.
* Antioxidant Properties: Prevents oxidation of metal surfaces to ensure clean solder joints.
* Activity Level: High activity flux, ideal for difficult-to-solder surfaces.
* Residue: Low-residue formula, often non-corrosive and non-conductive.
* Viscosity: Gel-like consistency for easy and precise application.
* Temperature Range: Effective at soldering temperatures, typically between 180°C to 300°C.
* Compatibility: Suitable for use with a wide range of metals and electronic components.
* Wetting Action: Fast and efficient wetting action for improved solder flow.
* Shelf Life: Long shelf life, maintaining quality and effectiveness over time.
* Safety: Non-toxic formulation, compliant with safety standards for electronic manufacturing
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Description
The MECHANIC Q60 Antioxidant Flux Paste is a high-performance soldering flux designed to facilitate the soldering process by cleaning and preparing the surfaces to be joined. It ensures a strong, reliable connection by preventing oxidation and promoting the flow of solder.
1. Antioxidant Properties: The flux paste contains antioxidants that prevent the formation of oxides on metal surfaces, ensuring a clean and effective solder joint.
2. High Activity: It is highly active, making it suitable for difficult-to-solder surfaces. It helps in removing oxidation and impurities from the surfaces, providing better wettability and soldering efficiency.
3. No-Clean Formula: This flux paste often features a no-clean formula, meaning that any residues left after soldering are non-corrosive and do not need to be cleaned off, simplifying the post-soldering process.
4. Wide Application Range: It can be used for a variety of applications, including PCB repair, component soldering, and rework operations. It is suitable for both manual and automated soldering processes.
5. Consistency: The paste has a thick, gel-like consistency, making it easy to apply precisely where needed without running or spreading too much.
6. Temperature Stability: It is designed to withstand high soldering temperatures, ensuring it remains effective throughout the soldering process.
Typical Applications
Usage Instructions
Safety and Handling
Packing Details: