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Amaoe Sc8280xp 52*60mm 0.12mm Stencil


₹ 220 ₹ 400 45% off


* Material: Japanese steel sheet
* Sternness: Super hard
* Hole  type: Square
* Re-usable: Yes
* Thickness: 0.12MM
 

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Only 4 Product left!

Description

Amaoe Sc8280xp 52*60mm 0.12mm Stencil

Amaoe 0.12mm Notebook CPU BGA Reballing Stencil for Qualcomm Snapdragon SC8280XP 

Amaoe Sc8280xp 52*60mm 0.12mm Stencil is used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.         

Package includes:

  • 1 x Stencil

                 Amaoe Sc8280xp 52*60mm 0.12mm Stencil

 

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