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Relife RL-402 No-clean 183°C Soldering Paste for Phones BGA Rebelling Soldering


₹ 174 ₹ 300 42% off


* RELIFE No-Clean Solder Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste For iphone Mobile Phone BGA

* RELIFE Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique Solder Making

* Technology, giving a new definition of tin-based technology

* RELIFE RL-402 No-Clean Solder Paste Sn63/Pb67 Solder Paste 183°C

* High quality 183°C solder paste

* Wick solder is strong

* Less residue

* No solder paste

1

Description

Relife RL-402 No-clean 183°C Soldering Paste for Phones BGA Rebelling Soldering 

 

The RELIFE RL-402 Soldering Paste is a high-quality soldering paste used in electronics and electrical work, ensuring strong and reliable solder connections.

Feature

1. Good adhesion. Paste delicate, particles small, only 20~38 microns.

2. Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.

3. Lead solder paste, 183 the degree of melting point, easy welding, easy molding

 

Application

Mobile phone chips repair, computer, and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 / forming fast and easy-to-weld conductive

  • Trusted by professionals
  • Smooth, clean finish
  • Quick melting, no mess
  • Ideal for BGA/SMT work

Apply directly to the soldering area using a fine-tip applicator. Heat with a hot air gun or soldering iron for best results.

 

Relife RL-402 No-clean 183°C Soldering Paste for Phones BGA Rebelling Soldering

 

RELIFE RL-402 SOLDERING PASTE 3

 

 

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