JTX 158°C 50g Solder Paste
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JTX 158°C 50g Solder Paste for mobile phone PCB CPU BGA chips soldering repair. JTX Black Champion high/medium/low temperature solder tin paste, no virtual soldering, easy to tin, anti-oxidation, widely used in mobile phone repair, sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT repairs, BGA chip reballing, etc.
Features:
1. Excellent welding effect: no virtual soldering, firm welding; full solder joints, uniform and delicate tin beads.
2. Strong wettability: high resistance activity and excellent welding performance.
3. Moderate viscosity: good thinness and consistency, patch components are not easy to offset, and solder paste is not easy to agglomerate.
4. No residue: ensuring the cleanliness of the circuit board after welding.
5. Multiple specifications available: with different melting point specifications such as low temperature 138°C, medium temperature 158°C, and high temperature 183°C, which can meet different welding needs.
6. Made of high-quality materials: safe and reliable, ensuring welding quality.
7. New formula and storage-resistant: its antioxidant capacity is at least 2 times higher than that of similar solder pastes.
Model: jtx-158.
Weight: 50g.
Suitable for: Double layers motherboard middle layer reballing, etc.
Features: Full tin balls antioxidant, no residue.
(FAQs) about JTX 158°C 50g Solder Paste:
JTX 158°C Solder Paste has a melting point of 158 degrees Celsius, making it suitable for medium-temperature soldering applications.?
This solder paste is ideal for soldering double-layer motherboards, BGA chip reballing, and other precision electronic repairs.
Allow the solder paste to reach room temperature naturally before use. Stir gently to ensure uniform consistency. Avoid rapid heating or excessive stirring, as this can degrade its properties.
It's not advisable to mix new and used solder paste as this can compromise the quality and performance of the product.
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