Description

JTX 138°C 50g  Low Temperature  Solder Paste For Soldering And  Reballing

JTX 138°C 50g Solder Pastes for mobile phone PCB CPU BGA chips soldering repair. JTX Black Champion high/medium/low temperature solder tin paste, no virtual soldering, easy to tin, anti-oxidation, widely used in mobile phone repair, sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT repairs, BGA chip reballing, etc.

Features:
1. Excellent welding effect: no virtual soldering, firm welding; full solder joints, uniform and delicate tin beads.
2. Strong wettability: high resistance activity and excellent welding performance.
3. Moderate viscosity: good thinness and consistency, patch components are not easy to offset, and solder paste is not easy to agglomerate.
4. No residue: ensuring the cleanliness of the circuit board after welding.
5. Multiple specifications available: with different melting point specifications such as low temperature 138°C, medium temperature 158°C, and high temperature 183°C, which can meet different welding needs.
6. Made of high-quality materials: safe and reliable, ensuring welding quality.
7. New formula and storage-resistant: its antioxidant capacity is at least 2 times higher than that of similar solder pastes.


Model: jtx-138.
Weight: 50g.
Suitable for: Tinned and desoldering, low-temperature welding.
Characteristics: Tin crawling strong, Bright and full solder joints.

(FAQs) about JTX 138°C 50g Solder Paste: 

1. What is the melting point of JTX 138°C Solder Paste?

JTX 138°C Solder Paste has a melting point of 138 degrees Celsius, making it suitable for low-temperature soldering applications.?

2. What are the primary applications of this solder paste?

This solder paste is ideal for soldering tasks such as mobile phone PCB CPU BGA chip repairs, sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT repairs, and BGA chip reballing.

3. Is this solder paste suitable for fine-pitch components?

Yes, JTX 138°C Solder Paste is formulated for high-precision maintenance, making it suitable for fine-pitch components and intricate soldering tasks. ?

4. How should I prepare the solder paste before use?

Allow the solder paste to reach room temperature naturally before use. Stir gently to ensure uniform consistency. Avoid rapid heating or excessive stirring, as this can degrade its properties.

5. Can I mix new solder paste with used paste?

It's not advisable to mix new and used solder paste, as this can compromise the quality and performance of the product.