JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 16 Pro Max
JTX SM-01 swap board platform designed for precise BGA chip reballing on iPhone 8 to 16 Pro Max.
High-precision stencil set for CPU, NAND, and other IC rework tasks.
Stable platform ensures accurate chip alignment during tinning and soldering.
Ideal tool for professional iPhone motherboard repair technicians.
Durable construction suitable for daily repair shop use.
Supports chip replacement and board-level maintenance operations.
Improves efficiency and accuracy in BGA reballing processes.
Compatible with multiple iPhone models from 8 to 16 Pro Max.
Essential fixture for advanced microsoldering and chip-level repairs.
Complete reballing stencil platform set for professional mobile repair labs.
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