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AMAOE S938U-012 S25 ULTRA S938U/W/D/B/BE/B2 STENCIL


₹ 145 ₹ 300 52% off


The AMAOE S938U-012 stencil is a precision reballing tool designed specifically for Samsung Galaxy S25 Ultra chipset and IC repair.

High-quality stainless steel construction ensures accurate solder ball placement for reliable Samsung S25 Ultra motherboard repairs.

Perfect for professional technicians, this stencil supports S938U/W/D/B/BE/B2 models for chip-level rework and reballing.

Laser-cut micro holes deliver precise alignment, making BGA and CPU reballing faster and more efficient.

Built for durability and repeated use, ideal for mobile repair shops and service centers.

Designed to simplify complex Samsung S25 Ultra IC repairs with high precision and consistency.

A must-have tool for advanced smartphone repair and motherboard rework tasks.

Helps achieve clean, accurate soldering results while reducing repair time.

Professional-grade stencil suitable for both beginners and expert mobile technicians.

Reliable and compact reballing stencil for precise Samsung Galaxy S25 Ultra chip repairs.

Out of Stock

Description

AMAOE S938U-012 S25 ULTRA S938U/W/D/B/BE/B2 STENCIL

 

Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra S938U/W/D/B/BE/B2
 
Package includes:
  • 2 x Tin Scraping Blade
  • 1 x Positioning Plate
  • 1 x Magnetic Base
  • 1 x Stencil

AMAOE S938U-012 S25 ULTRA S938U/W/D/B/BE/B2 STENCIL

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