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Mechanic/Amaoe MZ-5 Stencil


₹ 69 ₹ 300 77% off


High-precision MECHANIC/Amaoe MZ-5 stencil for professional mobile PCB reballing.

Durable stainless-steel stencil designed for accurate BGA solder work.

Perfect tool for IC chip reballing and motherboard repair tasks.

Ultra-thin design ensures precise alignment and smooth solder flow.

Ideal for mobile phone repair technicians and electronics workshops.

Heat-resistant stencil for reliable and long-lasting performance.

Compatible with multiple smartphone IC and BGA chip models.

Provides clean, uniform solder ball placement every time.

Lightweight and reusable stencil for daily repair use.

Essential rework tool for fast and efficient chip reballing jobs.

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Description

Mechanic/Amaoe MZ-5 Stencil

The Mechanic/Amaoe MZ-5 is a high-precision BGA reballing stencil designed specifically for professional electronics repair, targeting the Samsung S10 and S10+ series (Exynos and Snapdragon versions). It is widely recognized in the industry for its "black" anti-glare finish and square-hole design.

Below is the detailed product description organized for quick reference.

Technical Specifications Overview

Feature Details
Brand Mechanic / Amaoe (Collaborative Series)
Model MZ-5
Material High-Grade Japanese Imported Steel
Color/Finish Specialized Matte Black Anti-Glare Coating
Thickness 0.12mm (Ultra-thin for precision)
Hole Shape Square-holed (Prevents solder paste bridging)
Compatibility Samsung S10 / S10+ / Note 10 Series
Supported ICs CPU, RAM, PMIC, Audio, WiFi, and Baseband chips

Key Features & Benefits

The MZ-5 stands out due to its specific engineering choices that cater to micro-soldering professionals.

  • Anti-Drum Design: The stencil is engineered to remain flat under high heat, preventing the "warping" or "popping" effect often seen in cheaper stencils.

  • Square Mesh Holes: Unlike traditional round holes, the square design allows for easier release of solder paste, ensuring uniform solder balls across the entire BGA grid.

  • Heat Resistance: Rated for high-temperature stability, allowing for repeated use without deformation.

  • Laser Cutting Technology: Each hole is laser-cut with high precision to ensure 1:1 alignment with the original chip pads.

Detailed Chip Compatibility List

The MZ-5 is a "multi-purpose" stencil for the S10 generation. It covers almost every major integrated circuit on the logic board.

IC Category Components Supported
Processors Exynos 9820 / Snapdragon 855
Memory LPDDR4X RAM / UFS 2.1 & 3.0 Storage
Power Management Main PMIC, Sub-PMIC, and Charging ICs
Connectivity WiFi/Bluetooth Module, NFC Controller
RF/Signal Baseband Processor, RF Transceivers, Power Amplifiers
Audio/Misc Audio Codec, Sensors, and Display ICs

Usage Recommendations

To maximize the lifespan of your MZ-5 stencil and ensure a successful reballing process, follow these professional guidelines:

  1. Alignment: Ensure the IC is perfectly aligned using a microscope. The black coating helps provide high contrast against the silver pads.

  2. Solder Paste: Use high-quality solder paste (e.g., Mechanic 183°C or 138°C depending on the component sensitivity).

  3. Heat Application: Apply heat evenly in a circular motion. Because the stencil is 0.12mm thin, it reaches temperature quickly.

  4. Cleaning: Clean immediately after use using PCB cleaner or ultrasonic cleaning to prevent solder paste from hardening in the square holes.

Mechanic/Amaoe MZ-5 Stencil

Verified Reviews

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