2UUL BH41 TR-X-11 MID REBALL BASE Magnetic Platform Set
Precision magnetic reball platform designed for stable and accurate BGA rework.
Strong magnetic base ensures firm PCB holding during chip reballing.
Ideal tool for professional mobile phone repair technicians.
High-quality build for reliable and long-term daily use.
Perfect alignment support for mid-frame and motherboard repair jobs.
Anti-slip magnetic design improves work efficiency and accuracy.
Compatible with various smartphone motherboard reballing tasks.
Compact and durable platform for advanced repair workstations.
Enhances precision during soldering, heating, and chip positioning.
Essential reball base set for professional BGA repair and maintenance.
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2UUL BH41 TR-X-11 Magnetic Mid-Frame Reballing Platform Set
The 2UUL BH41 TR-X-11 is a high-precision magnetic reballing station engineered for the complex task of "sandwich" motherboard repair. Specifically designed for professional technicians, this platform facilitates the perfect alignment and soldering of the middle layers (interposers) of modern smartphone logic boards. By utilizing high-strength neodymium magnets and heat-resistant alloys, the BH41 ensures that stencils and boards remain perfectly registered during the critical heating phase, preventing solder bridges and failed connections.
| Feature | Detailed Specification |
| Product Name | 2UUL BH41 TR-X-11 MID REBALL BASE |
| Model | BH41 (TR-X-11 Series) |
| Base Material | Synthetic Stone (High-Temp Composite) + Premium Stainless Steel |
| Magnetic System | Multi-point Neodymium High-Strength Magnets |
| Compatibility | iPhone X through iPhone 15 Pro Max (Model specific inserts/stencils) |
| Heat Resistance | Up to 350°C (Continuous) |
| Function | Mid-layer Board Alignment & BGA Reballing |
| Platform Type | Magnetic Snap-on Universal Base |
| Dimensions | Approximately 100mm x 60mm x 15mm |
| Weight | ~280g (Solid base for stability) |
Precise Magnetic Positioning: The base features strategically placed magnets that automatically snap the reballing stencil into the exact micron-level alignment required for BGA pads.
Thermal Stability: Constructed from advanced synthetic stone, the base absorbs minimal heat, ensuring that your hot air station energy is focused entirely on the solder paste rather than heating the entire fixture.
Anti-Slip Foundation: The bottom of the BH41 is equipped with high-friction silicone pads, preventing the platform from sliding on the workbench during delicate micro-soldering.
Universal Compatibility: While the base is a singular unit, the TR-X-11 system supports a wide array of interchangeable magnetic stencils, making it a future-proof investment for evolving smartphone designs.
Oxidation Resistance: The metal components are treated with a specialized coating to resist flux corrosion and high-temperature oxidation.






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