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AMAOE X300P-XB-012 VIVO X300 PRO STENCIL


₹ 149 ₹ 400 63% off


AMAOE X300P-XB-012 stencil ensures precise Vivo X300 Pro reballing.

High-accuracy stencil designed for Vivo X300 Pro motherboard repairs.

Durable steel stencil delivers clean and reliable BGA rework.

Precision-crafted template supports efficient chipset soldering and maintenance.

Professional repair stencil ideal for Vivo X300 Pro technicians.

Heat-resistant design ensures stable performance during reballing operations.

Accurate hole alignment improves solder ball placement consistency greatly.

Premium-quality stencil enhances repair efficiency and soldering precision.

Reusable metal stencil suitable for advanced mobile repair tasks.

Essential repair tool for Vivo X300 Pro motherboard servicing.

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Description

AMAOE X300P-XB-012 VIVO X300 PRO STENCIL

The AMAOE X300P-XB-012 is a professional-grade, precision-engineered BGA (Ball Grid Array) reballing stencil specifically designed for the Vivo X300 Pro smartphone. It is an essential tool for micro-soldering technicians, enabling accurate solder ball placement on motherboard integrated circuits (ICs) and components during complex board-level repairs.

AMAOE X300P-XB-012

Feature Specification
Product Name AMAOE X300P-XB-012 BGA Reballing Stencil
Compatibility Vivo X300 Pro
Stencil Type BGA (Ball Grid Array) Small Board Reballing Stencil
Material High-Quality Stainless Steel
Thickness 0.12 mm
Manufacturing Precision Laser-Cut Technology
Heat Resistance High-temperature resistant (ideal for hot air rework stations)
Key Benefit Ensures accurate solder ball alignment and prevents bridging
Weight Approx. 0.02 kg
Application Chip-level repair, CPU, PMIC, and motherboard IC rework
Durability Reusable, anti-deformation material

Key Product Highlights

  • Precision Engineering: Manufactured using advanced laser-cutting techniques, the stencil features perfectly aligned holes that ensure uniform solder paste application, which is critical for successful reballing of high-density smartphone chips.

  • Optimal Thickness: The 0.12 mm profile is optimized for professional repair tasks, providing enough rigidity to maintain its shape during repeated heating cycles while remaining thin enough to allow for precise solder mask alignment.

  • Enhanced Repair Success: By providing a stable template for BGA rework, this tool minimizes human error, reduces the likelihood of solder bridges between pads, and helps technicians achieve factory-grade connections on Vivo X300 Pro motherboards.

  • Professional Durability: Built from premium stainless steel, the stencil is designed to withstand multiple high-temperature soldering operations without warping or losing its structural integrity. It is a reusable, cost-effective, and essential asset for any mobile service center or micro-soldering workstation.

AMAOE X300P-XB-012 VIVO X300 PRO STENCIL

Verified Reviews

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