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AMAOE SAM-22 STENCIL


₹ 159 ₹ 400 60% off


Precision Samsung IC reballing stencil for professionals.

Durable stainless steel stencil ensures accurate soldering.

Professional mobile motherboard repair reballing stencil tool.

High precision laser cut repair stencil design.

Reliable BGA stencil for Samsung chipset repairs.

Reusable stencil offering consistent repair performance daily.

Heat resistant stencil improves soldering repair accuracy.

Perfect alignment for efficient IC reballing applications.

Professional repair stencil built for long-term durability.

Essential tool for advanced mobile repair technicians.

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Description

AMAOE SAM-22 STENCIL

Product Description

The AMAOE SAM-22 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC repair. Manufactured from premium stainless steel, this stencil ensures accurate solder ball alignment, excellent heat resistance, and long-lasting durability. It is ideal for repairing compatible Samsung chipset ICs and motherboard components, making it an essential tool for mobile repair technicians.

Engineered with precision laser-cut holes, the AMAOE SAM-22 delivers consistent solder ball placement, reducing repair errors while improving reballing efficiency. Its thin yet durable construction allows even heat distribution during soldering, making it suitable for both beginners and professional repair workshops.

Whether you operate a repair center or perform advanced motherboard repairs, the AMAOE SAM-22 stencil offers reliable performance, precision, and durability for high-quality IC rework.

Specifications

Specification Details
Brand AMAOE
Model SAM-22
Product Type BGA Reballing Stencil
Material Premium Stainless Steel
Compatibility Compatible Samsung IC Reballing
Manufacturing Precision Laser Cut
Heat Resistance High Temperature Resistant
Thickness Ultra Thin Precision Design
Reusable Yes
Application Mobile Phone PCB & IC Repair

Features

  • Precision laser-cut stainless steel construction.
  • High accuracy solder ball alignment.
  • Excellent heat resistance during rework.
  • Durable reusable professional design.
  • Suitable for Samsung IC motherboard repairs.

Benefits

  • Produces accurate BGA reballing results.
  • Reduces solder bridging and repair mistakes.
  • Saves repair time and improves efficiency.
  • Long-lasting stainless steel construction.
  • Professional quality for repair technicians.

 

5 Bullet Points

  • Premium stainless steel precision reballing stencil.
  • Accurate laser-cut holes for perfect alignment.
  • High-temperature resistant for repeated professional use.
  • Designed for Samsung IC motherboard repair.
  • Ideal for mobile phone repair technicians.

 

Meta Description

Buy AMAOE SAM-22 stencil for Samsung IC BGA reballing and motherboard repair. Premium stainless steel laser-cut stencil for precise mobile phone PCB repair. Fast delivery across India.

AMAOE SAM-22 STENCIL

Verified Reviews

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