Oss Team C210-018 Series Knife Soldering Tip
* Item Type: Soldering Iron Tips
* Model: C210-018
* Material: Stainless Steel
* Product Length: Approx. 80mm / 3.1in
* Tip Diameter: Approx. 0.1mm / 0.004in
* Product Features: Environmentally friendly, rapid temperature rise, multi-layer electroplating, good oxidation resistance, tin removal, durable
* Adaptation: Suitable T210, T26 Handle
* Tip Features: The tip of the soldering iron tip is small
* Application Range: Suitable fine soldering or small soldering space, and can also correct the tin bridges generated when soldering chips.
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This matrix defines the exact dimensional engineering, physical profile, and material composition of the C210-018 blade component.
| Technical Parameter | Specification & Engineering Detail |
| Product Line Series | OSS Team C210 Series High-Precision Modules |
| Model Number Code | C210-018 (Integrated Knife / Blade Profile) |
| Tip Profile Geometry | 45° Beveled Knife Edge with a micro-thin flat working face |
| Blade Surface Thickness | ~1.5mm gradient tapering to a micro-edge |
| Internal Core Chemistry | Oxygen-free high-conductivity (OFHC) pure copper |
| Structural Plating Layers | Layered Iron-plating (anti-wear) backed by Chromium coating (anti-corrosion) |
| Tip Face Finish | Factory pre-tinned lead-free alloy coating |
| Total Assembly Length | Standardized 80mm inline form factor |
| Net Operational Weight | Approximately 4.5g to 5.0g |
This table details the energy distribution, efficiency metrics, and internal tracking electronics embedded within the tip.
| Performance Attribute | Metric Threshold & Behavior |
| Rated Power Handling | Optimized for stations scaling up to 45W - 75W burst outputs |
| Heating Integration | 3-in-1 Design (Heating element, thermocouple, and tip face are a single unit) |
| Thermal Recovery Cycle | Immediate loop correction (~1.5 seconds to return to setpoint) |
| Cold Startup Latency | Reaches standard working melting point (350°C) in 2 seconds |
| Operational Window | Stable operations across 100°C - 450°C range |
| Internal Sensor Array | Integrated internal K-Type Thermocouple feedback circuit |
| Insulation Resistance | >100M omega at standard environmental thresholds |
This matrix breaks down the exact micro-soldering tasks where the C210-018 knife tip excels on modern circuitry.
| Target Application Area | Technical Suitability & Rework Performance |
| IC Pad Drag Soldering | The flat edge of the blade cleans away residual solder from BGA footprints in a single pass without scratching the solder mask. |
| Micro-Jumper Wire Work | The sharp corner point (0.18mm effective radius) makes it easy to solder jumper wires directly to tiny component traces under a microscope. |
| FPC Flex Cable Bonding | Delivers even, linear heat across multi-pin row connectors, ensuring uniform joints for display or charging flex cables. |
| Underfill & Glue Removal | Safe to use alongside hot air to slice through tough black glue, epoxy resins, and UV structural adhesives around processors. |
| SMD Multi-Pin Rework | Simultaneously heats arrays of passive components or small outline IC pins (SOIC/TSOP) for rapid, damage-free removal. |
This data matrix highlights cross-system compatibility, environmental handling protocols, and care routines to extend tip life.
| Lifecycle Category | Protocol Rules & Technical Design Features |
| Handle Cross-Compatibility | Native fitment for OSS Team T210, JBC T210, Sugon T210, and Aixun T210 precision iron handles. |
| Static Control Compliance | Full ESD-Safe validation; directly grounded through the internal handle interface to eliminate voltage leaks. |
| Oxidation Protection | Advanced plating prevents alloy degradation when running lead-free processes (380°C- 420°C). |
| Best Cleaning Practices | Use high-density brass wire mesh or specialized tip tinner compounds; do not use file blocks or wet sponges. |
| Idle Standby Care | System firmware automatically cuts power when the tool is docked, preventing chrome layer blistering. |
Zero Heat Transfer Loss: Because the heating element is sealed inside the tip core, there is no thermal drop-off. Heat transfers instantly to the board without overheating nearby micro-components.
Dual-Use Tip Geometry: The long side edge handles large area cleaning and drag-soldering, while the sharp tip point easily manages fine micro-jumper work.
Toolless Plug-and-Play Swaps: Can be pulled out and swapped directly on the station cradle while hot, removing the need for cooling downtime or specialized wrench tools.



